MIL-HDBK-217F, Notice 2 provides selections for hermetic and non-hermetic DIPs, pin grid arrays (PGA) and surface mount (SMT) leaded and nonleaded devices via the package failure rate factor (C2) for microcircuits. The ‘hermetic’ selection would be appropriate for devices that meet seal test requirements of MIL-STD-883 Method 1014, or some other suitable test/screening standard. If a device fails to meet these requirements or if seal requirements are not applicable (e.g., as per MIL-PRF-38535 for plastic encapsulated microcircuits), then the ‘non-hermetic’ selection would be appropriate.

Richard Wisniewski,
Senior Reliability Engineer
Defense Systems Information Analysis Center (DSIAC)

Please note that the RIAC has been transitioned to the newly-formed Defense Systems Information Analysis Center (DSIAC). Inquiries related to the technical areas of reliability, maintainability and quality (RMQ) can continue to be made to the toll-free number at (877) 363-7422.