When I use 217Plus for PCB FR prediction by SMT assembly from RELEX, the inputs are only limited to temperature rise, etc. MIL-HDBK-217F methos has much more options by selecting different substrate materials or max joint distance, etc. How can 217Plus model for PCB taken into accounts those factors? Which method would be more reasonable for PCB assembly prediction, 217Plus or MIL-217F?
Your advice will be highly appreciated!