ktf asked 15 years ago
We try to use 217Plus from RELEX to do MTBF prediction on one of our Multi-Chip Microcircuit device.
Our MCM device is a multi-chip module (MCM) consisting of 5 bare IC dies, 9 Chip resistors and Chip capacitors. All the components are mounted by die attaching on one single laminated substrate then are encapsulated into a single plastic package.
For MTBF prediction on this big MCM device, do I just simply sum all the failure rates from individual components in 217Plus prediction or I should use the hybrid model for this big MCM chip prediction which I have to switch to MIL-HDBK-217F method where the hybrid model is only available (looks 217Plus does not offer hybrid model)?
Your advice will be highly appreciated!